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Freescale Semiconductor Technical Data
MPXA6115A Rev 3, 01/2007
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXA6115A/MPXH6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the pressure sensor a logical and economical choice for the system designer. The MPXA6115A/MPXH6115A series piezoresistive transducer is a state-ofthe-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * * * * * * Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40 to +125C Durable Thermoplastic (PPS) Surface Mount Package
MPXA6115A MPXH6115A SERIES
INTEGRATED PRESSURE SENSOR 15 TO 115 kPA (2.2 TO 16.7 psi) 0.2 TO 4.8 V OUTPUT SMALL OUTLINE PACKAGE
MPXA6115A6U/6T1 MPXA6115C6U/C6T1 CASE 482A-01 CASE 482-01
SMALL OUTLINE PACKAGE PIN NUMBERS(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
Typical Applications * * * * Aviation Altimeters Industrial Controls Engine Control/Manifold Absolute Pressure (MAP) Weather Station and Weather Reporting Device Barometers ORDERING INFORMATION
Device Type Options Case No. MPX Series Order No. Packing Options Device Marking
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead.
SUPER SMALL OUTLINE PACKAGE
MPXH6115A6U/6T1 CASE 1317-04
MPXH6115AC6U/C6T1 CASE 1317A-03
SMALL OUTLINE PACKAGE Basic Element Ported Element Absolute, Element Only Absolute, Element Only Absolute, Axial Port Absolute, Axial Port 482 482 482A 482A MPXA6115A6U MPXA6115A6T1 MPXA6115AC6U MPXA6115AC6T1 Rails Tape & Reel Rails Tape & Reel MPXA6115A MPXA6115A MPXA6115A MPXA6115A
SUPER SMALL OUTLINE PACKAGE PIN NUMBERS(1)
1 2 3 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
SUPER SMALL OUTLINE PACKAGE Basic Element Ported Element Absolute, Element Only Absolute, Element Only Absolute, Axial Port Absolute, Axial Port 1317 1317 MPXH6115A6U MPXH6115A6T1 Rails Tape & Reel Rails Tape & Reel MPXH6115A MPXH6115A MPXH6115A MPXH6115A
4
1317A MPXH6115AC6U 1317A MPXH6115AC6T1
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead
(c) Freescale Semiconductor, Inc., 2007. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
VOUT
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output
(2)
Symbol Pmax Tstg TA Io + Io -
Value 400 -40 to +125 -40 to +125 0.5 -0.5
Units kPa C C mAdc mAdc
Output Sink Current @ Minimum Pressure Offset(2)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
MPXA6115A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range Supply Voltage(1) Supply Current Minimum Pressure Offset(2) @ VS = 5.0 Volts Full Scale Output(3) @ VS = 5.0 Volts Full Scale Span(4) @ VS = 5.0 Volts Accuracy(5) Sensitivity Response Time
(6)
Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR -- --
Min 15 4.75 0.133 4.633 4.433 -- -- -- -- --
Typ -- 5.0 6.0 0.200 4.700 4.500 -- 45.9 1.0 20 0.25
Max 115 5.25 10 0.268 4.768 4.568 1.5 -- -- -- --
Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms ms %VFSS
Warm-Up Time(7) Offset Stability(8) 1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXA6115A Sensors Freescale Semiconductor 3
. +5.0 V Die P1 Stainless Steel Cap Thermoplastic Case VS Pin 2 MPXA6115A MPXH6115A Vout Pin 4 GND Pin 3 Absolute Element Sealed Vacuum Reference Die Bond 47 pF to ADC
Fluoro Silicone Gel Die Coat
Wire Bond Lead Frame
100 nF
51 K
Figure 2. Cross Sectional Diagram SSOP (Not to Scale)
Figure 3. Typical Application Circuit (Output Source Current Operation)
5.0 4.5 4.0 3.5 Output (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0
Transfer Function: Vout = Vs* (.009*P-.095) Error VS = 5.0 Vdc TEMP = 0 to 85C
MAX
TYP
MIN
Figure 4. Output versus Absolute Pressure Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85xC temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXA6115A/ MPXH6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
MPXA6115A 4 Sensors Freescale Semiconductor
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Pressure (ref: to sealed vacuum) in kPa
Transfer Function (MPXA6115A/MPXH6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 0.25 Vdc
Temperature Error Band
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0
MPXA6115A/MPXH6115A SERIES
Break Points Temp - 40 0 to 85 125 Multiplier 3 1 1.75
20
40
60
80
100
120
140
Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C
Pressure Error Band
3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure 15 to 115 (kPa) Error (Max) 1.5 (kPa) 20 40 60 80 100 120 Pressure (in kPa) Error Limits for Pressure
MPXA6115A Sensors Freescale Semiconductor 5
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.660 16.76
0.100 TYP 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
Figure 5. SOP Footprint (Case 482)
0.050 1.27 TYP 0.150 3.81 0.387 9.83
0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 6. SSOP Footprint (Case 1317 and 1317A)
MPXA6115A 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41
S
N C H -TPIN 1 IDENTIFIER SEATING PLANE
J K M
DIM A B C D G H J K M N S
CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE
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MPXA6115A Rev. 3 01/2007

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